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Large-Format Masks Move From Aspiration To Industry Roadmap

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Large-Format Masks Move From Aspiration To Industry Roadmap

The eBeam Initiative conducted its 15th annual Luminaries survey in July and reported the results on September 9, 2026, at its annual reception during the SPIE Photomask Technology + EUV Lithography Conference. 85 luminaries representing more than 45 companies participated.

At the close of the annual eBeam Initiative reception, an expert panel discussed a number of survey results, including large-format masks, equipment investment, High-NA EUV, and curvilinear masks. Moderator Aki Fujimura, CEO of D2S and co-founder of the eBeam Initiative, was joined by Harry Levinson of HJL Lithography, Naoya Hayashi, DNP Honorary Fellow, and Glen Scheid of Micron Technology (pictured in Figure 1). In this blog, I’ll report key insights shared by the panel.

Fig. 1: eBeam Initiative Luminaries Survey Results Discussed by Expert Panel (left to right, Aki Fujimura, Naoya Hayashi, Harry Levinson, Glen Scheid)

eBeam Initiative (Fujimura): 66% of luminaries predicted that the industry will adopt a large-format mask – approximately 6 x 12 inches – within the next decade. The survey was completed before TSMC and ASML announced an industry initiative targeting a 12-inch mask pilot line by 2031. Why is this transition happening now?

Levinson: The wafer fab argument is productivity. High-NA EUV systems are extremely expensive and occupy valuable cleanroom space. A large-format mask can expose a larger field without the process-control complexity of A/B stitching, with the potential for roughly 40% better productivity. That is a significant advantage when each additional system also adds facilities and power requirements.


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