Odisha lined up semiconductor projects worth about $4.7 billion, a push that could turn a state known for mining and metals into a chip-making base and test whether India can win a place in the global chip supply chain.

Odisha had approved five semiconductor projects worth more than $1.2 billion, Vishal Kumar Dev, additional chief secretary of the state's Electronics and IT Department, said at TiECon Bhubaneswar 2026. Two of the 12 projects approved under the India Semiconductor Mission were being set up in Odisha.

The state was building India's first compound semiconductor fabrication unit and advanced 3D chip packaging unit, Dev said. Construction on the projects began within six to eight months of approval, he added.

Odisha's largest projects covered several parts of the chain. ASP Semicon planned a memory chip module plant in Khordha with an investment of ₹4,620 crore, while SiCSem Private Limited planned a ₹3,406-crore plant making silicon carbide diodes and switching chips.

Silicon carbide is a tough material that handles high voltage and heat better than ordinary silicon, which makes it useful in electric vehicles, renewable energy and defence.

Two more projects focused on assembly and packaging, the stage where finished chips are cut, linked and tested. US-based 3D Glass Solutions proposed a ₹1,943-crore plant and partnered with Intel for what Dev called the country's first advanced 3D chip packaging facility. Sancode Semi planned a ₹1,650-crore assembly and testing unit at Info Valley-II.

Dev said advanced chip packaging was the next step and Odisha was gaining an edge in the field, particularly in glass-core technology, which uses glass instead of plastic or silicon as the base layer of a chip package.

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