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Chip Industry Technical Paper Roundup: Oct. 20

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Chip Industry Technical Paper Roundup: Oct. 20

Agentic AI for Heterogeneous System Design Across Chip, Scale-Up, and Scale-Out Domains

Understanding the Power Consumption of Modern High Bandwidth Memory : Experimental Analysis and Modeling Using Real HBM2 DRAM Chips

Back to the Future: Rethinking EDA Infrastructure for Agentic Systems in Chip Design Verification

Can Autonomous Vehicles Keep Their Cool? A Survey of Thermal Side-Channel and Perception Attacks



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