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Chip Industry Technical Paper Roundup: Oct. 13

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Chip Industry Technical Paper Roundup: Oct. 13

Integration of high-κ oxide on 2D semiconductors with carbon-dot monolayer assembly as van der Waals interfacial layer

UIUC , National Energy Technology Laboratory , Argonne National Laboratory , Monash University

Terracotta: Enabling the Adoption of New DRAM Techniques via a Flexible DRAM Interface and Memory Controller

Low-loss ultra-compact photonic bends with enhanced fabrication tolerance for commercial foundry processes



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