CONNECT WITH US
AI & Deeptech

AI & Deeptech

AI Image Enhancement Improves Detection Of Flip-Chip Interconnect Defects (MCL, PVA TePla, ASE)

Semiconductor Engineering logo

Published on

Add as a preferred source on Google
AI Image Enhancement Improves Detection Of Flip-Chip Interconnect Defects (MCL, PVA TePla, ASE)

Researchers at Materials Center Leoben, PVA TePla, and Advanced Semiconductor Engineering (ASE) published “AI-Based Image Enhancement Improves Detection of Interconnect Defects in Microelectronic Packaging.”

Abstract Excerpt:
“Traditional failure-analysis (FA) methods face growing challenges due to the increasing miniaturization and complexity of modern semiconductor devices. In particular, the detection of cracks in the extreme low K layers of flip-chips, utilized in advanced packaging architectures at the back end of line (BEOL), is challenging. To improve detectability of these so-called “white bumps”, we propose an AI-based image-enhancement workflow, specifically tailored to improve scanning acoustic microscopy (SAM) images.”

Wilhelmer, R., Djuric-Rissner, T., Czurratis, P. et al. AI-Based Image Enhancement Improves Detection of Interconnect Defects in Microelectronic Packaging. J Fail. Anal. and Preven. (2026). https://doi.org/10.1007/s11668-026-02537-z. Open access.



Source link
Related Topics:AI & Deeptech

Disclaimer

We strive to uphold the highest ethical standards in all of our reporting and coverage. We TheMorningPulse.fyi want to be transparent with our readers about any potential conflicts of interest that may arise in our work. It's possible that some of the investors we feature may have connections to other businesses, including competitors or companies we write about. However, we want to assure our readers that this will not have any impact on the integrity or impartiality of our reporting. We are committed to delivering accurate, unbiased news and information to our audience, and we will continue to uphold our ethics and principles in all of our work. Thank you for your trust and support.