A recent report from The Information suggested that TSMC is exploring 3D DRAM production at Nvidia's request as surging demand for AI hardware strains global DRAM supplies and drives up prices. If the proposal were to come to fruition, it could mean a new, albeit prone to cyclical risks, business for TSMC and could dramatically expand its role in the AI supply chain. For its part, TSMC states that it is a pure-play logic foundry and plans to remain a logic foundry, which essentially means a denial of the report.
- AI data centers are swallowing the world's memory and storage supply
- Samsung debuts three next-generation memory technologies for AI data centers
- The future of DRAM: From DDR5 to future ICs
- High-bandwidth memory roadmap
- Inside the history of DRAM price-fixing lawsuits
"Please note that TSMC focuses on our core business at all times, which is dedicated IC foundry," a TSMC spokesperson told Tom's Hardware. "Our mission is to be the trusted technology and capacity provider of the global logic IC industry for years to come."
Despite the denial, according to two people familiar with the initiative cited by The Information , TSMC has begun preparing plans for 3D DRAM manufacturing following a request from Nvidia, its largest customer. The initiative is reportedly overseen by Hsu Kuo-chin, TSMC’s vice president responsible for advanced packaging and former head of Micron’s Taiwanese operations. The effort comes amid widespread memory shortages that turned memory from a commodity into a strategic asset that could determine whether a company can ship its products to customers or not.
Source link







