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Qualcomm will license patents behind Huawei’s LogicFolding chip architecture, report says

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Qualcomm will license patents behind Huawei’s LogicFolding chip architecture, report says

Qualcomm has reached a deal to license Huawei patents behind the LogicFolding chip-stacking method, Bloomberg reports. The technology, which is used in the Kirin 9050 Pro, splits nearly every block across two bonded dies, and a teardown and die shots show the lower die holds mostly cache and I/O.

Qualcomm’s multiyear, cross-license deal with Huawei has a wide scope, covering 5G devices, AI services, near- and co-packaged optics and networks, a Huawei spokesperson told Bloomberg. Qualcomm also intends to purchase specific Huawei U.S. patents in compute, AI, networking, and other technologies, according to a release. Neither company’s announcement named any patents, LogicFolding, or any chip that uses it.

Bloomberg's report frames the deal as a win for Huawei, validating its chipmaking acumen. The deal remains subject to approval, and Qualcomm will reportedly pay Huawei to license its patents for the first time. According to the report, LogicFolding targets faster data transmission as a workaround for China’s lack of access to EUV lithography machines.

The Kirin 9050 Pro is used in the Huawei Mate XT 2 tri-fold smartphone, launched Sept. 7. Geekerwan, a Chinese tech review channel known for in-depth chip testing, had a lab slice the chip for its teardown. Kurnal, a semiconductor researcher who publishes die-shot analysis, also posted annotated shots of both dies on X. Geekerwan’s cross-section shows the two dies bonded face to face, and both show the execution units on top, with the PLLs also on the lower die.

LogicFolding was first unveiled on May 25 by He Tingbo, president of Huawei’s semiconductor business, at IEEE ISCAS 2026 in Shanghai, under the company’s “Tau Scaling Law,” which uses signal delay rather than transistor size as a measure.


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