Intel on Wednesday announced that it had started installing production tools at its Fab 62 in Arizona, and the fab is on track for mass production by late 2028. The company also reported progress on its Ohio One manufacturing complex and confirmed that it has integrated High-NA EUV lithography into high-volume manufacturing (HVM). Meanwhile, Intel continues to invest in its leading-edge process technology R&D, advanced packaging, and photomask production capabilities in the U.S., which puts the company ahead of the competition.
"There is an important difference between technologies made in America and technologies that are truly American-made," wrote Naga Chandrasekaran, executive vice president and chief technology and operations officer, Intel Foundry. "The difference lies in the research and development process that transforms ideas into manufacturable technologies."
Intel completed construction of its Fab 62 shell some time ago; now it is time for the company to begin installing production tools, which is what it is doing now. Intel expects the new facility to become operational before the end of 2028, although it has not disclosed when it intends to begin high-volume production or which nodes it will produce.
Intel has not officially assigned Intel 14A to Fab 62, although the facility has been discussed as a potential manufacturing site for the node. Meanwhile, there is an important distinction between Intel's original plans for Fab 62 and its current commitments. 8nm-class). Intel subsequently designated Fab 52 for Intel 18A manufacturing. Yet, Fab 62 remains unassigned.
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