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GlobalFoundries to produce silicon interposers for TSMC's CoWoS in the US — Five-year agreement valued at $2 billion

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GlobalFoundries to produce silicon interposers for TSMC's CoWoS in the US — Five-year agreement valued at $2 billion

GlobalFoundries and TSMC have entered into a five-year manufacturing agreement valued at $2 billion under which GlobalFoundries will produce silicon interposers for TSMC's CoWoS advanced packaging technology. The arrangement will establish a U.S.-based manufacturing source for these components, which will enable TSMC's clients to brand their products as completely made and packaged in America. Volume production is scheduled to ramp up in the first half of 2028.

"By providing manufacturing service using GF's trusted U.S. manufacturing footprint, we are creating a secure, scalable source of essential advanced-packaging elements that will help customers accelerate innovation and strengthen the semiconductor supply chain," said Ed Kaste, senior vice president of CMOS Business at GlobalFoundries.

Under the agreement, GlobalFoundries will expand manufacturing capacity at its fabrication facility in Malta, NY, to produce silicon interposers used in TSMC's CoWoS-S packaging ecosystem. Such interposers are custom pieces of silicon that provide high-density connections between logic chiplets and high-bandwidth memory (HBM) stacks and enable the creation of complex multi-die processors for artificial intelligence (AI) and high-performance computing (HPC) applications. The companies have not disclosed the production capacity to be installed, but the agreement provides a framework for additional expansion depending on demand.

Silicon interposers used for TSMC's CoWoS-S packaging technology are customized for particular processor designs, as their configurations depend on the number, dimensions, and placement of logic chiplets and HBM stacks, as well as the interconnections between them.

In addition, interposers must meet the power-delivery requirements of specific processors, including power distribution networks and embedded deep trench capacitors (DTC), and their designs must account for signal integrity, power integrity, and thermal characteristics.


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