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Department of War dishes out $1.5 billion loan commitment to boost semiconductor supply chain

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Department of War dishes out $1.5 billion loan commitment to boost semiconductor supply chain

U.S. Semiconductor Manufacturer Wolfspeed Inc. has received a conditional 30-year, $1.5 billion loan commitment letter from the U.S. Department of War (DoW) through its Office of Strategic Capital (OSC), as the country continues its push to boost domestic semiconductor manufacturing. According to an official press release on Oct. 7, Wolfspeed — which specializes in silicon carbide (SiC) and gallium nitride (GaN) materials and devices — will use the long term-financing to upgrade its GaN epitaxy capabilities and to develop radiation hardening capabilities for current SiC and future GaN products.

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The company says SiC and related technologies are “critical to next generation power and radio-frequency applications across defense, aerospace, AI, critical infrastructure and other strategic commercial markets,” and that it will focus on U.S. national security applications, including communications infrastructure and electronic warfare systems. “SiC and GaN have critical national security applications,” said Wolfspeed CEO Robert Feurle. “With this financing, the company would be well positioned to not only continue to serve the DoW but also expand its capabilities for the benefit of U.S. national security as a whole,” he continued.

5% of its fully diluted equity. The warrants would be priced off the stock's volume-weighted average price (VWAP) and handed over in proportion to each tranche of the loan as it's funded. As of this report, the loan remains conditional, pending the OSC’s completion of its due diligence.


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