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Bambu Lab’s 3D printing patent application for a new heatbed design may improve peeling issues

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Bambu Lab’s 3D printing patent application for a new heatbed design may improve peeling issues

Shenzhen Tuozhu Technology, Bambu Lab’s parent company, has filed a patent application in the U.S. for a new heatbed design, which was published on September 10, 2026. This design aims to heat a printbed more evenly, reducing issues with prints as commonly reported by many users of various 3D printer brands. The patent describes the construction, heating method, and its claim of better adhesion to improve print quality.

The abstract of patent US20260264331A1 states: “The heated bed comprises a heated bed body, a heating unit, and a bottom case, wherein one end of the heating unit is configured to be electrically connected to one end of a power supply, and the other end of the heating unit is configured to be electrically connected to the other end of the power supply; the heating unit is disposed between the heated bed body and the bottom case. The heating unit is attached to a surface, proximal to the bottom case, of the heated bed body, and the heating unit is configured to heat the heated bed body. By implementing the present application, the adhesion capability of the print panel can be improved and the print quality can be improved.”

It’s hard to imagine from the abstract alone, but the patent’s sheets visually show us what Bambu Lab is trying to achieve, and the claims tell us more details. The current heatbeds use a laminated heating sheet, adhered to a sheet of aluminum with magnets to hold a build plate. ” Looking at FIG.


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