As AI and data center devices grow in complexity, with multi-chiplet designs and power envelopes in the thousands of watts, testing every device under real-world conditions has never been more important.
Ben Mitchel, senior director of product management and business development for integrated systems test, discusses why system-level test is now mission-critical in high-volume manufacturing and how Teradyne’s Titan HP platform delivers the power, thermal management, and throughput that AI and cloud infrastructure devices require.
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