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Designing Multi-kW Power Delivery In 3D Heterogeneously Integrated Systems (U. of Minnesota)

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Designing Multi-kW Power Delivery In 3D Heterogeneously Integrated Systems (U. of Minnesota)

Researchers at the University of Minnesota published a technical paper titled “Toward Multi-kW Power Delivery Methodologies for Advanced 3D Heterogeneous Integration.”

Abstract Excerpt: “Computationally powerful systems require significant power for computation: reliable and robust power delivery is a major challenge in light of high power densities and pin count bottlenecks. This paper overviews approaches to building design methodologies that overcome this problem, through the design of multistage distributed power delivery systems, optimized for performance and reliability, and built to coexist within stringent performance, thermal, and reliability constraints.”

Yue, Peiyi, Hangyu Zhang, Ratul Das, Ramesh Harjani, and Sachin S. Sapatnekar. “Toward Multi-kW Power Delivery Methodologies for Advanced 3D Heterogeneous Integration.” arXiv preprint arXiv:2609.24904 (September 2026). https://arxiv.org/abs/2609.24904

The post Designing Multi-kW Power Delivery In 3D Heterogeneously Integrated Systems (U. of Minnesota) appeared first on Semiconductor Engineering.



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